Effects of voids on thermal-mechanical reliability of lead-free solder joints

Reliability eeboo coupons of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met.Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under stickers logos dallas cowboys thermal cycles.In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

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